MIL-STD-883 Testing

Compliant Quality Conformance Testing for MIL-STD-883

GROUP B TESTS

Class B and S Microcircuits

GROUP C TESTS

Life Tests

GROUP D TESTS

Package Related Tests

MECHANICAL TESTS

Devices are subjected to different destructive and non-destructive mechanical stresses including, but not limited to, vibration, twisting, and bending.

ENVIRONMENTAL TESTS

Devices are subjected to different varying environmental conditions. Including but not limited to, temperature, humidity, and barometric pressure.

GROUP D TESTS

Subgroup 1

  • Physical Dimension

 

Subgroup 2

  • Lead/Terminal Integrity Test
  • Fine Leak & Gross Leak
  • BGA/CGA Packages
  • Ball Shear test for BGA Package
  • Solder Column pull test for CGA Package

 

Subgroup 3 

  • Thermal Shock
  • Temperature Cycling
  • Moisture Resistance
  • Visual Examination
  • Fine Leak & Gross Leak
  • End-point Electrical Parameters

 

 Subgroup 4

  • Mechanical Shock
  • Vibration Variable Frequency
  • Constant Acceleration
  • Fine Leak & Gross Leak
  • Visual Examination
  • End-point Electrical Parameters

Subgroup 5

  • Salt Atmosphere
  • Visual Examination
  • Fine Leak
  • Gross Leak

 

Subgroup 6

  • Internal Water Vapor

 

Subgroup 7

  • Adhesion of Lead finish

 

Subgroup 8

  • Lid Torque

 

Subgroup 9

  • Soldering Heat
  • Fine Leak & Gross Leak
  • External Visual Examination
  • End-point Electrical