White Papers

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At Golden Altos, we’re not your cookie-cutter assembly service. You know what you want your design to do; our engineering staff is here to make your goal a reality.

Below is a recently published technical paper:
Golden Altos White Papers-Cuztomizing Processes for Hermetic Assembly of Devices Designed for Plastic Packages

Today’s leading-edge semiconductor devices are designed and manufactured for high volume, low cost industrial and consumer-based products. The design and layout of these integrated circuit (ICs) favor plastic molded assembly with an eye toward reduced cost, not dependability. This leaved the high reliability, low volume military and aerospace applications with fewer hermetic package choices directly form the Original Component Manufacturer (OCM). The challenge exists to bridge the reliability requirements of military and aerospace communities with leading edge ICs designed for the mass market.

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