Q. What is Wire bonding

A. It is the process of creating electrical interconnections between semiconductors (or other integrated circuits) and silicon chips using bonding wires. 

Q. What are the wire materials that GA used in Wire bonding?

A. Gold Wire & Aluminum Wire

Q. What are the two common wire bonding types?

A. Aluminum Wedge Bonding & Gold Ball/ Ball Bonding

Q. What is Aluminum Wedge Bonding?

A. Wedge bonding is typically performed at ambient temperature using pressure and ultrasonic energy to form the wire bonds, most often used with aluminum bond wire to bond to aluminum (Al) or gold (Au) bond pads. 

Q. What is Gold Ball/ Wedge Bonding?

A. Ball bonding is typically performed using a combination of temperature, pressure, and ultrasonic energy to form the wire bonds which is most often used with gold bond wire. 

Q. What is the bonded ball diameter and the wire feed angle that GA uses for Fine Pitch Wire Bonding?

A. Golden Altos uses uses 40µm inline ball bond 60°,90° deep access  wire feed for Al bonding.

Q. What is Gold Ribbon Bonding?

A. It is a high-purity vacuum-processed from highly refined metals and provided on a wide range of wire spool types, suitable for use on all models of wire bonding equipment. Applications include interconnecting semiconductor devices, wafer bumping, stud bump, and interconnecting of other microelectronic and related assemblies.

Q. What is Burn in testing?

Q. How does Burn-in Testing Work?

Q. Is Burn-in test good?

Q. What Different types of PC boards are designed and manufactured at Golden Altos?

• Universal and dedicated Burn-in Boards
• Custom driver cards & Pattern Generator
• Program Cards  & other Scrambling Boards
• Socket Card Adapters & other Conversion
• Load Boards and Tester  Interface H/W
• Performance and Demo Cards

Q: What is Die Attach Process?

A. It is a process of picking a chip from a wafer and placing it onto a substrate or metal lead frame.

Q: What are the two common die attach processes?

A. Adhesive Die Attach & Eutectic Die Attach

Q: What is Adhesive Die Attach?

A. Adhesive die attach uses adhesives such as polyimide, epoxy, and silver-filled glass as die attach material to mount the die on the die pad or cavity. The adhesive is first dispensed in controlled amounts on the die pad or cavity. The die for mounting is then ejected from the wafer by one or more ejector needles.

Q: What is Eutectic Die Attach?

A. Eutectic die attach, which is commonly employed in hermetic packages, uses a Eutectic Alloy to attach the die to the cavity. A eutectic alloy is an alloy with the lowest melting point possible for the metals combined in the alloy.

Q: What is Die Shear Test?

A. Die/package shear testing is a high force shear test to measure the adhesion between the die and the substrate. It is an ideal method for measuring glue, solder, and sintered silver bonded areas. The test is easy to implement and can be used on thin and larger die.

Q: What is Stud-pull Test?

A. The stud-pull test measures the bond strength of dies and other flat components to the substrate. This is a complimentary technique to the more common die shear test, with both methods being used to get a full understanding of the die-substrate bond strength.

Q: What problems and issues are commonly encountered with the Die Attach process?

• Die Attach Voids
• Die Cracking
• Solder Shorting
• Die Scratching
• Die Metallization Smearing
• Lost Die
• Die Placement
• Die Rotation

Q: What is Die Attach Material?

A. Die attach materials are the materials that are used to attach in a components. Die attach materials comprise two key functions including intemperance of heat produced in the die, and mechanical fixation of the die on the substrate.

Q. What are the materials that GAC used in Die attach process?

A. List of Materials

• Silver Glass QMI 269,
• Silver Filed Cyanate Ester:JM7000,
• Silver Filed Epoxy

Q: What is Silver Glass QMI 2569 (Conductive)?

A. A wide temperature processing, no-dry, silver glass die attach adhesive for the attachment. of integrated circuits in both solder seal and glass seal hermetic packages. The material can allow the. simultaneous processing of die attach and Leadframe embedding while producing a void-free bondline.

Q: What are the packages that GAC used for glass sealing?

A. CDIP, CERQUAD, PGA

Q: What are the packages that GAC used for gold tin sealing?

A. LCC, LLCC, CQFP, PGA, CERAMIC, SOIC

Q: What are the packages that GAC used for Silver Filed Cyanate Ester: JM 7000?

A. For Co-Fired Packages only such as LCC, LLCC, CQFP, PGA, CERAMIC, SOIC

Q: What is silver filed Epoxy used for?

A. It is use to circuit board repair, surface mount connections, static discharge, shielding, and grounding. The material is ideal for solderless connections and bonding of heat-sensitive components. The Conductive Silver Epoxy bonds aggressively to a wide variety of materials including solder, glass, and copper.

Q: What is Sealing?

A. Sealing is the surface-to-surface joining technique of materials using a substance which usually is of a different type, and which adheres to the surfaces of the two adherents to be joined, transferring the forces from one adherent to the other. The substance used for sealing is known as a sealant or sealer.

Q: What is Encapsulation?

A. It is a step where a semiconductor chip is wrapped with a certain material to protect it from the  external environment.

Q: What sealing process does GAC offer?

A. Glass Sealing, Solder Sealing, Seam Sealing, Weld Sealing & Oven Sealing

Q: What is solder sealing?

A. is a process wherein an Integrated Circuit housing utilizes a metal preform, typically 80Au 20Sn, attached to the lid to create a solder fillet which creates a hermetic seal.

Q: What is glass sealing Package?

A. Utilize a highly insulating frit glass to create a hermetic seal. This process can be used for devices which incorporate materials that have higher temperature processing requirements as the frit glass can typically withstand temperatures up to 450C.

Q: What is Hermetic Sealing?

A. Is a variation of the seam sealing process which results in a closed package completely sealed against ambient atmosphere, preventing the entry or escape of air. The process is most often employed in the manufacture of electronic devices. Part design and fit-up is critical in these applications to create hermetic seals.

Q: What is Non-Hermitic Sealing?

A. When the term “near hermetic” package or “non-hermetic” packaging is used it implies the package is made from polymeric materials as opposed to glasses, metals and ceramics.

Q. What is Lead Finish?

A. is the process of applying a coat of metal over the leads of an IC to protect the leads against corrosion and abrasion and to improve the leads’ solderability and appearance.

Q. What are the 2 types of solder that GA Used in soldering?

A. Leaded Solder & Leaded-Free Solder

Q. What are the differences between leaded solder and Leaded-Free solder?

• Leaded Solder
  • Sn63/pb37- a mixture of 63% tin and 37% lead. 
  • its low melting point (183°C) is easy to work with, flows well, and forms strong bonds with other metals. 
  • Leaded solder makes “shiny” joints when properly used.
• Lead-Free Solder
  • Sn96.5 /Ag3.0/Cu0.5– formulations have a varied percentage of metals. 
  • Components can include tin, copper, silver, nickel, and zinc. 
  • The most common lead-free mix is tin-copper, which has a melting point of 217°C. Lead-free solders have properties that are distinct from traditional lead-tin mixes
  • Lead-free solder makes more “matte” appearance joints.

Q. What is Assembly Test? 

A. It is an element of inspection that determines the properties or elements, including functional operation of materials, equipment, or their components, by the application of established scientific principles and procedures.

Q. Does GA Perform MIL-STD-883 test?  What Test Method does GAC offer? 

A. Yes, GAC can do the following test method: 

• Environmental Tests 
  • Temperature Humidity 
  • Barometric Pressure 
• Mechanical Tests  
  • Vibration 
  • Constant Acceleration 
  • Lead Integrity 
• Electrical Tests
  • Different Levels of Supply Voltage 
  • Threshold and Non-Threshold Voltages 
• Test Procedures
  
  • Screening 
  • Quality 
  • Qualification conformance procedures 

Q: About the App

A. The Golden Altos app gives our customers the ability to get real time updates on their orders whether it’s an assembly job on our manufacturing line or a qualification test in our lab. Along with one-click direct messaging to our customer service team, we’ve made security a key feature by using a 2-factor authentication login, ensuring that any sensitive information provided stays secured.

Q. What are the Features of the Mobile Application?

Q. Where can I Download the Mobile App?

A.  You can download the mobile app from the play store or app store or download from Here: Our App