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MIL-STD-883 Testing

Compliant Quality Conformance Testing for MIL-STD-883

GROUP B TESTS

Class B and S Microcircuits
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GROUP C TESTS

Life Tests
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GROUP D TESTS

Package Related Tests
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MECHANICAL TESTS

Devices are subjected to different destructive and non-destructive mechanical stresses including, but not limited to, vibration, twisting, and bending.
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ENVIRONMENTAL TESTS

Devices are subjected to different varying environmental conditions. Including but not limited to, temperature, humidity, and barometric pressure.
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GROUP B TESTS

For Class V (S) Devices

Subgroup 1

  • Physical Dimension
  • Vibration Variable Frequency

 

Subgroup 2

  • Resistance to Solvent
  • Internal Visual & Mechanical Bond Strength
  • Substrate Attach

 

Subgroup 3

  • Solderability

Subgroup 4

  • Fine Leak
  • Gross Leak
  • Lid Torque

 

Subgroup 5

  • Steady State Life

 

Subgroup 6

  • Temperature Cycle
  • Constant Acceleration
  • Fine Leak
  • Gross Leak

For Class Q (B) Devices

Subgroup 2

  • Resistance to Solvent

 

Subgroup 2

  • Solderability

 

Subgroup 3 

  • Bond Strength

GROUP C TESTS

Subgroup 1A

  • Steady-State life Test
    • TM 1005 45 (0) 1000 hours at 125℃
  • End-Point Electrical Parameters
    • as specified in applicable device procurement specification
 

GROUP D TESTS

Subgroup 1

  • Physical Dimension

 

Subgroup 2

  • Lead/Terminal Integrity Test
  • Fine Leak & Gross Leak
  • BGA/CGA Packages
  • Ball Shear test for BGA Package
  • Solder Column pull test for CGA Package

 

Subgroup 3 

  • Thermal Shock
  • Temperature Cycling
  • Moisture Resistance
  • Visual Examination
  • Fine Leak & Gross Leak
  • End-point Electrical Parameters

 

 Subgroup 4

  • Mechanical Shock
  • Vibration Variable Frequency
  • Constant Acceleration
  • Fine Leak & Gross Leak
  • Visual Examination
  • End-point Electrical Parameters

Subgroup 5

  • Salt Atmosphere
  • Visual Examination
  • Fine Leak
  • Gross Leak

 

Subgroup 6

  • Internal Water Vapor

 

Subgroup 7

  • Adhesion of Lead finish

 

Subgroup 8

  • Lid Torque

 

Subgroup 9

  • Soldering Heat
  • Fine Leak & Gross Leak
  • External Visual Examination
  • End-point Electrical

MECHANICAL TESTS

  • Constant Acceleration (Method 2001)
  • Mechanical Shock (Method 2002)
  • Solderability (Method 2003)
  • Lead Integrity (Method 2004)
  • Vibration Variable Frequency (Method 2007)
  • Bond Strength Destructive Bond Pull Test (Method 2011)
  • Resistance to Solvents (Method 2015)
  • Physical Dimensions (Method 2016)

ENVIRONMENTAL TESTS

  • Moisture Resistance (Method 1004)
  • Steady State Life (Method 1005)
  • Salt Atmosphere Corrosion (Method 1009)
  • Temperature Cycling (Method 1010)
  • Thermal Shock (Method 1011)
  • Seal  (Method 1014)
    •  Fine Leak
    • Gross Leak Test
  • Burn-In Test (Method 1015)
  • Internal Water Vapor Content (Method 1018)
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