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Package Configurations

Open cavity ceramic and specialty package options

We offer package assembly for a wide variety of standard ceramic and specialty packages.

Golden Altos is experienced in assembling a wide range of package types and sizes; from 3-lead LCCs to 559-lead PGAs and nearly everything in between. We also cover a wide range of specialty hybrid packages.

We’ll work with your existing packages or Golden Altos can source packages through our ongoing relationships with recognized package manufacturers.

 Standard Ceramic Packages

Ceramic SOIC
Ceramic SOIC
CERDIP
CERPAC
CERPAC
CERQUAD
CERQUAD
CQFP
CQFP
FLATPACK
Flatpack
Leaded Chip Carrier with “J” bend leads
JLCC
Leadless Chip Carrier
LCC
Pin Grid Array
PGA
CERDIP
Sidebraze

Specialty Packages

Chip On Board (COB)
Hybrid
Hybrid
Metal TO Cans
Metal TO Cans
Multichip Module
Multichip Module
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Ceramic SOIC

Small Outline Integrated Circuit Package (SOIC)

  • The SOIC package is a surface-mounted device designed to meet increasing miniaturization and component density demand. 
  • The SOIC package is a rectangular “Dual In-line” style ceramic package.

CERDIP

Ceramic Dual Inline Package with Lead Frame

  • The CERDIP dual-in-line package has the same high performance characteristics as the standard three-layer ceramic package, yet is a cost-effective alternative.  It is a military approved package with excellent reliability characteristics.

CERPAC

Ceramic Package with unformed Leads on two opposite sides

  • The Cerpac is a hermetic ceramic package that is a low-cost alternative to a standard multi-layer flatpack.
  •  It is a high-performance military-approved package that also offers excellent reliability characteristics.

CERQUAD

Ceramic Package with unformed Leads on all four sides.

  • Cerquad packages are constructed of a single pressed layer of 92% Alumina (Al203), with a leadframe embedded into a non-vitreous glass.
  • The lead configurations are either flat leaded, J-bend, or gullwing.
  • These packages do not have a metalized seal ring and they use a ceramic cap.
  • Some packages are designed with a ceramic window frame attached to the top of the base to provide added strength. 
  • Hermetic and non-hermetic versions are available.

CQFP

Ceramic Quad Flat Pack with Bottom Leads on all four sides

  • A ceramic IC package with leads extending from all four sides of the package body.
  • CQFP’s are predominantly square in shape, although rectangular variants do exist.
  • The CQFP is just one of the many types of quad flat pack (QFP) packages.

FLATPACK

Ceramic Package with Bottom leads on all four sides

  • Typically found with leads greater than 24 on all four sides of the ceramic body. 
  • These packages are hermetically sealed and are used for surface mount applications. 
  • They can be soldered directly to a PC Board or used in a socket.
  •  The lead spacing depending on the package can come in .015, .020, .025, and .050 inches.

JLCC

Leaded Chip Carrier with “J” bend leads

  • Square or rectangular surface-mount ceramic package that has J-formed leads around its periphery.
  • The plastic-molded equivalent of the JLCC is the PLCC.
  • Typical JLCC’s have lead counts that range from 20 to 84.

LCC

Leadless  Chip Carrier

  • Leadless Chip Carriers continue to be a popular package for surface mount applications. 
  • The Leadless Chip Carrier’s low profile and multilayer construction offers short internal electrical traces from the die to the metalized castellations around all sides and on the bottom of the package. 

PGA

Pin Grid Array

  • Ceramic Pin Grid Array Packages offer high I/O signal carrying capacity
  • Excellent electrical performance and
  • high thermal heat dissipation, with minimum package size. 

SIDEBRAZE

Ceramic Dual Inline Package with attached leads

  • The standard Sidebraze package, commonly known as a “DIP”, consists of two rows of leads brazed onto the sides of the ceramic.
  • The row spacing varies from lead count but can come in .300, .400, .600, and .900 inch wide configurations.

Chip On Board (COB)

Printed circuit board with die and wire bond

HYBRID

  • Mixed components in the same package. 
  • The Hybrid may consist of a single construction or be made up of sub-modules. 
    • Each module usually contains a compartment to house the hermetically packaged hybrids and discrete passive component parts such as transformers, axle-lead resistors, etc.

Metal TO Cans

Metal Transistor Outline Can-type package

Multichip Module

  • Multiple Integrated Circuits in the same package
  • Is a special carrier of hybrid microcircuits and components interconnected as one unit.
  • It can be considered a component of an electronic subsystem.
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