Package Configurations
Open cavity ceramic and specialty package options
We offer package assembly for a wide variety of standard ceramic and specialty packages.
Golden Altos is experienced in assembling a wide range of package types and sizes; from 3-lead LCCs to 559-lead PGAs and nearly everything in between. We also cover a wide range of specialty hybrid packages.
We’ll work with your existing packages or Golden Altos can source packages through our ongoing relationships with recognized package manufacturers.
Standard Ceramic Package Options
SOIC Packages: Leading Modern Miniaturization
Small-outline integrated circuit (SOIC) packages are compact, rectangular, “Dual In-line” ceramic packages engineered to fulfill the escalating need for miniaturization and enhanced component density. With surface-mounted design, the SOIC packages ensure optimal space utilization and dependable performance, catering to diverse applications across consumer electronics, telecommunications, and industrial equipment sectors.
Ceramic Dual Inline Package (CERDIP): Optimal Performance, Affordable Solutions
Ceramic Dual Inline Package (CERDIP) with a lead frame ensures an optimal performance at a competitive price point. The CERDIP packages maintain the high-performance standards of standard three-layer ceramic packages, providing a cost-effective alternative. With military approval and exceptional reliability, these packages are customized for demanding applications.
Cerpac: High Performance, Military-Approved Reliability
The Cerpac is a hermetic ceramic package featuring unformed leads on two opposite sides. This low-cost alternative to a standard multi-layer flatpack delivers high performance and military-approved reliability.
Cerquad Package: Versatile Ceramic Solution
A Cerquad package features unformed leads on all four sides and is typically crafted from a single pressed layer of 92% Alumina (Al₂O₃) with an embedded leadframe in non-vitreous glass. Available in flat leaded, J-bend, or gullwing configurations, these packages offer flexibility for diverse applications.
Ceramic Quad Flat Pack (CQFP): Bottom Leads on All Four Sides
The Ceramic Quad Flat Pack (CQFP) is a versatile ceramic IC package with leads on all four sides. Available in square and rectangular variants, the CQFP is ideal for high-density applications, offering excellent performance and reliability. Choose Golden Altos for advanced ceramic IC packaging solutions.
Bottom Leads on All Four Sides for High-Density Applications
A bottom lead Ceramic Package features bottom leads on all four sides, typically with over 24 leads. Hermetically sealed and suitable for surface mount applications, these packages can be soldered directly to a PC board or used in a socket. With lead spacing options of .015, .020, .025, and .050 inches, they offer versatility for high-density electronic applications.
Leaded Chip Carrier (JLCC) with J-Bend Leads: High-Density Surface-Mount Solution
The Leaded Chip Carrier (JLCC) is a square or rectangular surface-mount ceramic package featuring J-formed leads around its periphery. With lead counts ranging from 20 to 84, JLCC packages provide a reliable and efficient solution for high-density applications.
Leadless Chip Carrier (LCC): Ideal for Surface Mount Applications
The Leadless Chip Carriers (LCC) is a popular choice for surface mount applications. With their low profile and multilayer construction, LCCs provide short internal electrical traces from the die to the metalized castellations around all sides and on the bottom of the package, ensuring efficient performance.
Ceramic Pin Grid Array (PGA): High Performance and Thermal Dissipation
Ceramic Pin Grid Array (PGA) packages, designed to deliver high I/O signal carrying capacity, excellent electrical performance, and superior thermal heat dissipation, all within a compact package size.
Ceramic Dual Inline Package (DIP) with Attached Leads: Sidebraze Design
The standard Sidebraze package, commonly known as a “DIP”, featuring two rows of leads brazed onto the sides of the ceramic body. With row spacing options varying based on lead count, configurations include .300, .400, .600, and .900 inches wide, ensuring versatility for diverse applications
Specialty Packages
COB Printed Circuit Board: Integrating Die and Wire Bond Technology
Chip-On-Board (COB) printed circuit board, seamlessly integrating die and wire bond technology. This innovative solution offers compact integration of electronic components, optimizing space utilization and enhancing performance.
Golden Altos Metal TO Cans: Robust Transistor Outline Packages
Metal TO Cans are a robust type of Transistor Outline (TO) package. Known for their durability and reliability, these cans provide effective protection for electronic components.
Golden Altos Hybrid Solutions: Integration of Mixed Components
Golden Altos leads in Hybrid assembly services, sourcing packages with mixed components seamlessly integrated. Hybrid package options can be constructed as a single unit or composed of sub-modules, each equipped with compartments to house hermetically packaged hybrids alongside discrete passive components like transformers and axle-lead resistors.
Golden Altos Multi-Chip Modules: Integration Redefined
Multi-Chip Modules (MCMs), revolutionizing integration with multiple integrated circuits housed within a single package. Serving as a specialized carrier for hybrid microcircuits and interconnected components, MCMs unify disparate elements into a cohesive unit, effectively functioning as a component within an electronic subsystem.
