Assembly Capabilities

Complete onshore, Hi-Rel IC packaging

Golden Altos provides packaging services for engineering, prototyping, and production products. Our military and space level packaging conforms to MIL-PRF-38535 requirements for monolithic devices and MIL-PRF-38534 for hybrids and MCMs.

Die Attach Material

Die Attach Process

Wire Bonding Capabilities

Sealing and Encapsulation

Assembly Testing


Lead Finish

Additional Services

Die Attach Material

                         Silver Glass: QMI 2569                           (Conductive)

Silver Filled Cyanate Ester: JM 7000

Gold Tin Sealed Packages

  • LLC
  • LLCC
  • CQFP
  • PGA
  • Ceramic SOIC


Glass Sealed Packages

  • CDIP
  • PGA

Co-Fired Packages

  • LCC
  • LLCC
  • CQFP
  • PGA
  • Ceramic SOIC

Other Adhesives

  • Silver-Filled Epoxy (Conductive)
    • 84-1
    • H20E
  • Electrically Insulating Epoxy (Non-Conductive)
    • 84-3


  • 98% Gold/ 2% Silicon Preform
  • 80% Gold/ 20% Preform

Die Attach Process

  • Golden Altos uses state-of-the-art Die Attach equipment for Silver Glass die attach material in order to optimize die planarity and maintain consistent Bond Line Thickness (BLT) on every unit processed.
  • Golden Altos will also use a DESC approved Cyanate Ester (JM7000) die attach material as an alternative to silver glass for use with solder sealed or welded hermetic packages.
  • For builds requiring eutectic die attach, Golden Altos employs workers skilled in this art.

Wire Bonding Capabilities

Golden Altos uses high-speed, fine-pitch wire bonders and offers, as standard, a variety of wire types and diameters. These choices allow us to match the wire bonding to your specific needs. Whether your requirements are high current, high frequency, or anything in between, Golden Altos has a solution for you.

Aluminum Wedge Bonding

Wire Diameter (mils)

0.70, 1.0, 1.25, 2.0, 3.0, 5.0, 10, 15

Gold Ball / Wedge Bonding

Wire Diameter (mils)

0.70, 1.0, 1.25

Ribbon Bonding

Wire Diameter (mils)

0.25 mils x 1.4 mils up to 2 mils x 10 mils

Sealing and Encapsulation

Golden Altos offers both Solder Sealing (Gold-Tin Eutectic) and Glass Sealing processes for ceramic packages.

Parallel Seam Sealing

Wide Range of Hybrid

MCM Packages

Resistance Welding







Residual gases (from sealed cavity parts) are regularly monitored to ensure long-term reliability.

For certain requirements, Golden Altos can “glob top” with encapsulation material suitable for non-hermetic custom packages.

Assembly Testing

Quality conformance Military Test Flows Capability includes:

  • Die Shear/Stud Pull Strength
  • Bond Strength
  • Constant Acceleration (Centrifuge)
  • Particle Impact Noise Detection (PIND) 
    • Class S
  • External Visual
  • Substrate Attach Strength
  • Seal
    • Fine Leak
    • Gross Leak
  • Temperature Cycling
  • Solderability
  • Resistance to Solvents
  • Non-Destructive Bond Pull
    • Class S
  • Lid Torque 
    • Glass-sealed packages


Golden Altos used industry standard inks to mark devices.

  • We mark on ceramic, plastic, gold lids or other metals. 
  • Our marking and curing is compliant with MIL-STD-883 Method 2015 for Resistance to Solvents (Mark Permanency).
  • In addition to standard part marking, serialization is also available.


Lead Finish

For packages requiring lead finishing, Golden Altos offers hot solder dipping using (Tin/Lead) composition solder.



Lead Free


Additional Services

Saw & Plate

  • Wafer size up to 12 inches
  • Returned on the sticky film frame or in waffle packs

Tape Lids

for quick-turn engineering includes

  • saw
  • plate
  • visual
  • wirebond
  • tape lid/cap

Saw, Plate & 2nd Optical Visual

  • Military
  • Commercial

Demark & Remark

  • Black Top Mechanical
  • Eraser Chemical removal

Add Mark

  • Add additional marking to existing mark