Assembly Capabilities
Complete onshore, Hi-Rel IC packaging
Golden Altos's Guide to Understanding Die Attach Process
The die attach process is critical to success in the challenging world of microelectronics manufacturing. To achieve the best possible results, Golden Altos uses state-of-the-art Die Attach equipment for die attach in order to optimize die planarity and maintain consistent Bond Line Thickness (BLT) on every unit processed
Understanding Die Attach Process:
Die attach, also known as die bonding or die mounting, is a critical process in semiconductor manufacturing. It involves attaching a semiconductor to the die pad of a support structure, such as a lead frame or metal can header, in the semiconductor package. This technique establishes the foundation for the end product’s reliable performance and lifespan.
Golden Altos’ Solutions:
At Golden Altos, we utilize advanced Die Attach equipment to optimize the die planarity and maintain consistent Bond Line Thickness (BLT) on every unit processed. The use of this equipment allows for meticulous attention to detail and ensures uniformity and reliability across all assembly processes.
- Furthermore, we offer alternative solutions to cater to diverse assembly needs. DESC approved Cyanate Ester (JM7000) die attach material as an alternative to silver glass, particularly suited for use with solder sealed or welded hermetic packages. This flexibility allows us to adapt to varying requirements without compromising on quality or performance.
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Eutectic Die Attach Expertise: For builds requiring eutectic die attach, Golden Altos relies on skilled workers proficient in this specialized art. Our team’s expertise ensures precise execution and adherence to industry standards, delivering superior results with every build
Partner with Golden Altos:
When it comes to microelectronics assembly, trust Golden Altos to be your partner of choice. With our commitment to innovation, precision, and reliability, we’re here to help you achieve your assembly goals with confidence.
To summarize, the die attach process is a vital step in microelectronics assembly, and at Golden Altos, we’re dedicated to mastering it with excellence. From advanced equipment to skilled expertise, we ensure that every unit processed meets the highest standards of quality and performance.