Assembly Capabilities
Complete onshore, Hi-Rel IC packaging
Unlocking the Potential of Wire Bonding: Capabilities at Golden Altos
Wire bonding is an essential technique in microelectronics manufacturing, as it ensures reliable electrical connections within semiconductor devices. Golden Altos takes pride in its superior wire bonding capabilities, which can be customized to fulfill a wide range of requirements. Let’s go into the specifics of our wire bonding services and how they can help your assembly process.
Understanding Wire Bonding:
Wire bonding is a method used to create interconnections between an integrated circuit (IC) and its package, utilizing fine wires to connect the IC to the external leads of the semiconductor device. This process is essential for maintaining electrical connectivity and ensuring the overall functionality of the device.
Golden Altos’ Wire Bonding Capabilities:
Golden Altos uses high-speed, fine-pitch wire bonders and offers a standard variety of wire types and diameters. These choices allow us to match the wire bonding to your specific needs. Whether your requirements are high current, high frequency, or anything in between, Golden Altos has a solution for you.
Aluminum Wedge Bonding
– Wire Diameter (mils): 0.7, 1.0, 1.25, 2.0, 3.0, 5.0, 10, 15
Gold Ball/Wedge Bonding
– Wire Diameter (mils): 0.7, 1.0, 1.25
Ribbon Bonding
– Wire Diameter (mils): 0.25 x 1.4 up to 2 x 10
Partner with Golden Altos:
When it comes to wire bonding, Golden Altos stands out as a trusted partner. Our advanced capabilities and commitment to quality make us the ideal choice for your microelectronics assembly needs. Trust us to provide the solutions you need to achieve your project goals with precision and reliability.
To summarize, wire bonding is a crucial component of microelectronics assembly, and Golden Altos excels in providing advanced, reliable, and customized wire bonding solutions. Partner with us to unlock the full potential of your projects and experience the difference that our expertise and state-of-the-art capabilities can make.z
