Assembly Capabilities
Complete onshore, Hi-Rel IC packaging
Sealing and Encapsulation Services at Golden Altos
Sealing and encapsulation are important processes in microelectronics manufacturing that protect and extend the life of electronic components. Golden Altos offers advanced sealing and encapsulating solutions customized to your specific needs.
Sealing and Encapsulation Capabilities:
Golden Altos offers multiple hermetic and non hermetic sealing options. With over 40 years of IC packaging experience, let us help you decide which option is best for your application. We strive to provide high yield hermetic sealing to ensure your component can be relied on in any application.
Hermetic Sealing Techniques:
- Solder Seal provides a robust and reliable seal, ideal for applications requiring durable, long-lasting protection.
- Frit Glass Seal provides an impermeable barrier by fusing glass particles to create a monolithic seal.
- Parallel Seam Sealing wide range of hybrid and MCM packages.
- Resistance Welding is suitable for a variety of TO packages, including TO-3, TO-5, TO-8, TO-39, TO-46, and TO-100, resulting in strong and long-lasting seals.E
Quality Assurance:
We regularly monitor residual gases from hermetically sealed components to ensure long-term reliability and performance of your product.
Encapsulation Solutions:
For non-hermetic custom packages, Golden Altos offers “glob top” encapsulation and other epoxy sealing options with materials designed to provide effective protection and durability.
To summarize, Golden Altos excels in providing expert sealing and encapsulation services to enhance the protection and longevity of your electronic components. Trust us to deliver reliable, high-quality solutions for all your microelectronics assembly needs.
