Assembly Capabilities
Complete onshore, Hi-Rel IC packaging
Additional Services at Golden Altos
At Golden Altos, we offer a range of additional services designed to support your microelectronics assembly needs. Our capabilities ensure precision, reliability, and quick turnaround times, tailored to meet both military and commercial standards.
Wafer Processing
Wafer Saw and Plate
- Wafer Size Compatibility: Handling wafers up to 12 inches.
- Return Options: Depending on your preferences, you can return wafers in a sticky film frame or waffle packs.
2nd Optical Visual
We provide thorough second optical visual inspections to ensure the highest standards of quality and reliability for both military and commercial applications.
- MIL-STD-883 – TM 2010
- MIL-STD-883 – TM 2017
- MIL-STD-750 – TM-2069, TM-2070, TM-2072, TM-2073, TM-2074
Prototype Engineering – Our prototype assembly service is ideal for rapid engineering needs. We can provide sealed components or taped lids ideal for die evaluation during characterization activities. The prototype assembly process includes the following:
- Sawing Plating
- Visual Inspection
- Wire bonding
- Tape Lid/Capping
Demark & Remark Services
Demark: For precise and clean removal of ink marks without damaging the components.
Remark: Adding additional markings to existing marks for enhanced traceability and identification.
Why Choose Golden Altos:
Golden Altos offers comprehensive additional services to support your microelectronics assembly projects.
- Precision and Reliability: Advanced techniques and thorough inspections ensure high-quality results.
- Versatility: Catering to military and commercial needs with a wide range of services.
- Quick Turnaround: Efficient processes to meet your urgent engineering requirements.
- Customization: solutions customized according to the specific requirements.
