Assembly Capabilities
Complete onshore, Hi-Rel IC packaging
Golden Altos provides packaging services for engineering, prototyping, and production products. Our military and space level packaging conforms to MIL-PRF-38535 requirements for monolithic devices and MIL-PRF-38534 for hybrids and MCMs.
Die Attach Material
Die Attach Process
Wire Bonding Capabilities
Sealing and Encapsulation
Assembly Testing
Marking
Lead Finish
