Assembly Capabilities
Complete onshore, Hi-Rel IC packaging
Comprehensive Assembly Testing Services at Golden Altos
Ensuring the highest possible level of reliability and quality in microelectronic assembly is critical. At Golden Altos, we offer a wide range of assembly testing services to meet rigorous military and industry standards. Our comprehensive testing capabilities ensure that your components perform flawlessly in the most demanding environments.
Our Testing Capabilities Include:
- Die Shear/Stud Pull Strength Assessing the mechanical integrity of die and wire bonds.
- Substrate Attach Strength Measuring the adhesion strength of substrates.
- Bond Strength Evaluating the robustness of wire bonds and other connections.
- Non-Destructive Bond Pull Evaluating bond strength without damaging the component.
- Constant Acceleration (Centrifuge) Testing the durability of components under high acceleration forces.
- Particle Impact Noise Detection (PIND) Identifying loose particles within sealed packages to prevent failures.
- External Visual Inspecting components for visual defects and ensuring conformance to specifications.
- Fine Leak Detecting minute leaks in hermetic seals.
- Gross Leak Identifying larger leaks in hermetically sealed packages.
- Temperature Cycling Testing the resilience of components under extreme temperature variations.
- Solderability Assessing the ability of components to form reliable solder joints.
- Resistance to Solvents Ensuring components can withstand exposure to cleaning solvents.
- Lid Torque Measuring the torque required to remove lids from sealed packages.
- Non-Destructive Analysis
- Radiography (X-ray)
- Confocal Scanning Acoustic Microscopy (CSAM)
Partner with Golden Altos:
Golden Altos provides a full suite of assembly testing services designed to meet the most demanding requirements. Trust us to deliver reliable, high-quality testing solutions that ensure your components perform to their fullest potential.
