The Standard Dicing Process

Golden Altos Insider-The Standard Dicing Process-Dicing Blade and Process Selection

Golden Altos uses conventional mechanical dicing for device singulation since this is highly supported by the equipment manufacturer, DISCO, and a widely accepted method for the semiconductor industry. We use diamond-filled dicing blades from DISCO and other reputable dicing blade manufacturers for silicon wafers and the choice of the dicing blade dimension will depend on […]