Fremont, CA, September 20, 2024—Golden Altos Corporation is excited to announce its participation in the upcoming 57th International Symposium on Microelectronics, taking place from September 30 to October 3, 2024, at the prestigious Encore Boston Harbor, Boston, Massachusetts.
At IMAPS 2024, industry professionals will gather to explore the latest innovations in microelectronics and advanced packaging. Golden Altos Corporation will be showcasing our expertise in microelectronic assembly and packaging solutions. You’ll find us at Booth #409, ready to connect and discuss how our services can support high-reliability applications in a variety of industries.
This symposium is packed with valuable sessions and discussions focused on Design, Modeling and Manufacturing, Fanout, RDL, WLP / PLP, High Performance / High Reliability, and Advanced Package Technologies such as Flip Chip, 2.5D, 3D, and Optical Solutions. It also offers insights into Advanced Processes and Materials, which are critical for next-gen innovation.
Mark your calendars and make sure to visit us at Booth #409! We look forward to connecting, discussing industry trends, and sharing the latest innovations in high-reliability microelectronics packaging.
Event Details:
Conference: 57th International Symposium on Microelectronics
Date: September 30 – October 3, 2024
Location: Encore Boston Harbor, Boston, Massachusetts
Stay tuned for more updates from our team as we bring back the latest developments and expertise to our customers!
