Fremont CA, February 17, 2026 — Golden Altos Corporation will exhibit at the IMAPS Device Packaging Conference (DPC 2026), taking place March 3-6, 2026, in Phoenix, Arizona.
The IMAPS Device Packaging Conference 2026 is a leading event focused on microelectronics, advanced packaging, and semiconductor device technologies. Golden Altos will showcase its expertise in high-reliability IC packaging, hermetic assembly, qualification, and test services for defense, aerospace, and mission-critical applications.
Visit Golden Altos at Booth 612 to learn how our U.S.-based, in-house hermetic assembly and IC packaging capabilities support advanced device packaging requirements while meeting MIL-STD-883 and MIL-PRF standards.
As a trusted DLA QML supplier, Golden Altos delivers secure, compliant, and high-reliability microelectronics solutions for complex programs requiring precision, traceability, and long-term performance.
Event Details
Conference: IMAPS Device Packaging Conference 2026
Date: March 3-6, 2026
Location: Phoenix, Arizona
Booth: 612
About the IMAPS DPC 2026
The IMAPS Device Packaging Conference (DPC 2026) is one of the most comprehensive technical programs and exhibitions focused on microelectronics and advanced packaging. The conference highlights emerging technologies, semiconductor packaging innovations, materials advancements, and government and defense applications.
Attendees include industry leaders, engineers, researchers, equipment suppliers, materials manufacturers, and government agencies working across the advanced packaging ecosystem.
Learn more about the event: https://imaps.org/
