Fremont CA, March 18, 2024-The 20th International Conference and Exhibition on Device Packaging (IMAPS) is currently taking place, and Golden Altos Corporation is pleased to announce its participation and success thus far. The event, which is scheduled for March 18–21, 2024, in Fountain Hills, Arizona, has given professionals in device packaging a unique chance to interact and work together.
Golden Altos Corporation is exhibiting its most recent developments and solutions in device packaging at booth 54. Visitors are welcome to network with the Golden Altos team, learn about state-of-the-art technology, and consider possible joint ventures. The IMAPS conference has been extremely beneficial in promoting thought-provoking conversations, opportunities for networking, and idea sharing.
Golden Altos Corporation is appreciative of the chance to help make the event a success and looks forward to working with peers and industry partners in the future.
